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  rev.2.00, jun.25.2004, page 1 of 9 H5N2305PF silicon n channel mos fet high speed power switching rej03g0026-0200z rev.2.00 jun.25.2004 features ? low on-resistance ? low leakage current ? high speed switching outline 1 2 3 d g to-3pfm s 1. gate 2. drain 3. source
H5N2305PF rev.2.00, jun.25.2004, page 2 of 9 absolute maximum rating (ta = 25 c) item symbol rating unit drain to source voltage v dss 230 v gate to source voltage v gss 30 v drain current i d 35 a drain peak current i d (pulse) note1 140 a body-drain diode reverse drain current i dr 35 a body-drain diode reverse drain peak current i dr (pulse) note1 140 a avalanche current i ap note3 18 a channel dissipation pch note2 60 w channel to case thermal impedance ch-c 2.08 c /w channel temperature tch 150 c storage temperature tstg ?55 to +150 c notes: 1. pw 10 s, duty cycle 1% 2. value at tc = 25 c 3. stch = 25 c, tch 150 c
H5N2305PF rev.2.00, jun.25.2004, page 3 of 9 electrical characteristics (ta = 25 c) item symbol min typ max unit test condition drain to source breakdown voltage v (br)dss 230 ? ? v i d = 10 ma, v gs = 0 zero gate voltage drain current i dss ??1 av ds = 230 v, v gs = 0 gate to source leak current i gss ??0.1 av gs = 30 v, v ds = 0 gate to source cutoff voltage v gs(off) 2.5 ? 4.0 v v ds = 10 v, i d = 1 ma forward transfer admittance |yfs| 22 38 ? s i d = 17.5a, v ds = 10 v note4 static drain to source on state resistance r ds(on) ? 0.030 0.038 ? i d = 17.5a, v gs = 10 v note4 input capacitance ciss ? 5200 ? pf output capacitance coss ? 690 ? pf reverse transfer capacitance crss ? 50 ? pf v ds = 25 v v gs = 0 f = 1 mhz turn-on delay time td(on) ? 60 ? ns rise time tr ? 130 ? ns turn-off delay time td(off) ? 180 ? ns fall time tf ? 120 ? ns i d = 17.5 a r l = 5.7 ? v gs = 10 v rg = 10 ? total gate charge qg ? 105 ? nc gate to source charge qgs ? 25 ? nc gate to drain charge qgd ? 37 ? nc v dd = 160 v v gs = 10 v i d = 35 a body-drain diode forward voltage v df ? 0.92 1.4 v i f = 35 a, v gs = 0 note4 body-drain diode reverse recovery time trr ? 180 ? ns body-drain diode reverse recovery charge qrr ? 1.3 ? c i f = 35 a, v gs = 0 dif/dt = 100 a/ s notes: 4. pulse test
H5N2305PF rev.2.00, jun.25.2004, page 4 of 9 main characteristics 80 60 40 20 0 50 100 150 200 30 10 3 1 0.3 0.1 13 0.1 0.3 10 30 100 300 1000 100 80 60 40 20 0 4 8 12 16 20 100 80 60 40 20 0 246810 0.03 0.01 100 300 1000 ta = 25 c v = 5 v gs 7 v tc = 75 c 25 c -25 c channel dissipation pch (w) case temperature tc ( c) power vs. temperature derating drain to source voltage v ds (v) drain current i d (a) maximum safe operation area drain to source voltage v ds (v) drain current i d (a) typical output characteristics pulse test gate to source voltage v gs (v) drain current i d (a) typical transfer characteristics v = 10 v ds pulse test 100 s 1 ms pw = 10 ms (1shot) dc operation (tc = 25 c) 10 s 5.5 v 6 v 8 v 10 v operation in this area is limited by r ds(on)
H5N2305PF rev.2.00, jun.25.2004, page 5 of 9 2 1.6 1.2 0.8 0.4 0 48 12 16 20 1 20 300 1000 100 210 0.1 0.05 0.02 0.01 0.1 0.08 0.06 0.04 0.02 ?25 0 25 50 75 100 125 150 0 0.1 0.3 3 30 1000 100 20 50 5 10 2 0.5 1 0.2 0.1 1 10 300 100 gate to source voltage v gs (v) drain to source saturation voltage vs. gate to source voltage drain to source saturation voltage v ds(on) (v) drain current i d (a) drain to source on state resistance r ds(on) ( ? ) static drain to source on state resistance vs. drain current case temperature tc ( c) static drain to source on state resistance r ds(on) ( ? ) static drain to source on state resistance vs. temperature drain current i d (a) forward transfer admittance vs. drain current forward transfer admittance |yfs| (s) 25 c tc = ?25 c 75 c ds v = 10 v pulse test v gs = 10 v pulse test 5 a pulse test pulse test v gs = 10 v,15v i = 35 a d 17.5 a 17.5 a i d = 35 a 5 a
H5N2305PF rev.2.00, jun.25.2004, page 6 of 9 0.1 0.3 1 3 10 30 300 100 100 1000 200 500 100 20 50 10 0 50 100 150 2000 5000 10000 1000 100 200 500 400 0 16 300 12 200 8 100 4 40 80 120 160 200 0 10000 1000 10 100 0.1 0.3 1 3 10 30 1000 100 300 20 50 10 v = 0 f = 1 mhz gs ciss coss crss i = 35 a d v dd v gs reverse drain current i dr (a) reverse recovery time trr (ns) body-drain diode reverse recovery time capacitance c (pf) drain to source voltage v ds (v) typical capacitance vs. drain to source voltage gate charge qg (nc) drain to source voltage v ds (v) gate to source voltage v gs (v) dynamic input characteristics drain current i d (a) switching time t (ns) switching characteristics di / dt = 100 a / s v = 0, ta = 25 c gs v = 160 v 100 v 50 v ds r t r t d(on) t d(off) t t f v = 10 v, v = 100 v pw = 5 s, duty 1% r = 10 ? gs dd g v = 160 v 100 v 50 v ds
H5N2305PF rev.2.00, jun.25.2004, page 7 of 9 0 0.4 0.8 1.2 1.6 2.0 100 80 60 40 20 v = 0 v gs 10 v source to drain voltage v sd (v) reverse drain current vs. source to drain voltage reverse drain current i dr (a) pulse test 5 4 3 2 1 -25 0 25 50 75 100 125 150 0 case temperature tc ( c) gate to source cutoff voltage vs. case temperature gate to source cutoff voltage v gs(off) (v) v = 10 v ds vin monitor d.u.t. vin 10 v r l v = 100 v dd tr td(on) vin 90% 90% 10% 10% vout td(off) vout monitor 10 ? 90% 10% t f switching time test circuit waveform 5 v i = 10 ma d 1 ma 0.1 ma
H5N2305PF rev.2.00, jun.25.2004, page 8 of 9 0.3 0.1 0.03 0.01 3 1 0.003 0.001 10 100 1 m 10 m 100 m 1 10 10 0 dm p pw t d = pw t ch ? c(t) = s (t)  ch ? c ch ? c = 2.08 c/w, tc = 25 c tc = 25 c pulse width pw ( s ) normalized transient thermal impedance s (t) normalized transient thermal impedance vs. pulse width d = 1 0.5 0.2 0.1 0.05 0.02 0.01 1shot puls e
H5N2305PF rev.2.00, jun.25.2004, page 9 of 9 package dimensions 0.66 15.6 0.3 5.5 0.3 3.2 0.3 5.45 0.5 4.0 0.3 5.0 0.3 2.7 0.3 19.9 0.3 21.0 0.5 1.6 0.86 3.2 + 0.4 ? 0.2 2.6 0.86 5.45 0.5 5.0 0.3 + 0.2 ? 0.1 2.0 0.3 0.9 + 0.2 ? 0.1 package code jedec jeita mass (reference value) to-3pfm ? ? 5.2 g as of january, 2003 unit: mm ordering information part name quantity shipping container H5N2305PF-e 30 pcs plastic magazine note: for some grades, production may be terminated. please contact the renesas sales office to check the state of production before ordering the product.
keep safety first in your circuit designs! 1. renesas technology corp. puts the maximum effort into making semiconductor products better and more reliable, but there is a lways the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placeme nt of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials 1. these materials are intended as a reference to assist our customers in the selection of the renesas technology corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to renesas t echnology corp. or a third party. 2. renesas technology corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents i nformation on products at the time of publication of these materials, and are subject to change by renesas technology corp. without notice due to product improvement s or other reasons. it is therefore recommended that customers contact renesas technology corp. or an authorized renesas technology corp. product distrib utor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. renesas technology corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies o r errors. please also pay attention to information published by renesas technology corp. by various means, including the renesas techn ology corp. semiconductor home page (http://www.renesas.com). 4. when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, a nd algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. renesas technology corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. renesas technology corp. semiconductors are not designed or manufactured for use in a device or system that is used under ci rcumstances in which human life is potentially at stake. please contact renesas technology corp. or an authorized renesas technology corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerosp ace, nuclear, or undersea repeater use. 6. the prior written approval of renesas technology corp. is necessary to reprint or reproduce in whole or in part these materi als. 7. if these products or technologies are subject to the japanese export control restrictions, they must be exported under a lic ense from the japanese government and cannot be imported into a country other than the approved destination. any diversion or reexport contrary to the export control laws and regulations of japan and/or the country of destination is prohibited. 8. please contact renesas technology corp. for further details on these materials or the products contained therein. sales strategic planning div. nippon bldg., 2-6-2, ohte-machi, chiyoda-ku, tokyo 100-0004, japan http://www.renesas.co m renesas technology america, inc. 450 holger way, san jose, ca 95134-1368, u.s.a tel: <1> (408) 382-7500 fax: <1> (408) 382-7501 renesas technology europe limited. dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, united kingdom tel: <44> (1628) 585 100, fax: <44> (1628) 585 900 renesas technology europe gmbh dornacher str. 3, d-85622 feldkirchen, germany tel: <49> (89) 380 70 0, fax: <49> (89) 929 30 11 renesas technology hong kong ltd. 7/f., north tower, world finance centre, harbour city, canton road, hong kong tel: <852> 2265-6688, fax: <852> 2375-6836 renesas technology taiwan co., ltd. fl 10, #99, fu-hsing n. rd., taipei, taiwan tel: <886> (2) 2715-2888, fax: <886> (2) 2713-2999 renesas technology (shanghai) co., ltd. 26/f., ruijin building, no.205 maoming road (s), shanghai 200020, china tel: <86> (21) 6472-1001, fax: <86> (21) 6415-2952 renesas technology singapore pte. ltd. 1, harbour front avenue, #06-10, keppel bay tower, singapore 098632 tel: <65> 6213-0200, fax: <65> 6278-8001 renesas sales offices ? 2004. renesas technology corp., all rights reserved. printed in japan. c olophon .1 .0


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